12
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporations quality certifications can be viewed at website www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Inte rsil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other ri ghts of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web sit ewww.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
2401 Palm Bay Road
Palm Bay, FL 32905
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil Ltd.
8F-2, 96, Sec. 1, Chien-kuo North,
Taipei, Taiwan 104
Republic of China
TEL: 886-2-2515-8508
FAX: 886-2-2515-8369
ISL6432
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the MO Series Symbol List in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension E does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. L is the length of terminal for soldering to a substrate.
7. N is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width B, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
1   2   3
-B-
0.25(0.010)
C  A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
?/DIV>
0.25(0.010)
B
M
M
?/DIV>
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532    0.0688
1.35
1.75
-
A1
0.0040    0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075    0.0098
0.19
0.25
-
D
0.3859    0.3937
9.80
10.00
3
E
0.1497    0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284    0.2440
5.80
6.20
-
h
0.0099    0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
16
16
7
?/DIV>
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
相关PDF资料
ISL6521CBZS2698 IC REG QD BCK/LINEAR 16-SOIC
ISL6528CBZ-TS2698 IC REG DL BCK/LINEAR SYNC 8-SOIC
ISL6529CBZ IC REG DL BCK/LINEAR SYNC 14SOIC
ISL6534CVZ-TR5229 IC REG 3OUT BCK/LINEAR 24EPTSSOP
ISL6549CRZR5213 IC REG DL BCK/LINEAR SYNC 16-QFN
ISL9305IRTHWLNCZ-T IC REG QD BUCK/LINEAR 16TQFN
ISL9305IRTWLNCZ-T IC REG QD BUCK/LINEAR 16TQFN
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